NEC TOPPAN Circuit Solutions Phils, Inc. (TNCSi) manufactures high density multilayer and Build- up Printed Wiring Boards (PWBs) applied to telecommunication infrastucture, medical equipment and industrial appratus. Our Company is currently expanding particularly in the area of design engineering (CAM Applications). Chosen candidates will have overseas training opportunity in Japan and will be part of a growing business as well.
NEC TOPPAN Circuit Solutions Phils, Inc. (TNCSi) manufactures high density multilayer and Build- up Printed Wiring Boards (PWBs) applied to telecommunication infrastucture, medical equipment and industrial appratus. Our Company is currently expanding particularly in the area of design engineering (CAM Applications). Chosen candidates will have overseas training opportunity in Japan and will be part of a growing business as well.
NEC TOPPAN Circuit Solutions Phils, Inc. (TNCSi) manufactures high density multilayer and Build- up Printed Wiring Boards (PWBs) applied to telecommunication infrastucture, medical equipment and industrial appratus. Our Company is currently expanding particularly in the area of design engineering (CAM Applications). Chosen candidates will have overseas training opportunity in Japan and will be part of a growing business as well.